The photovoltaic industry has experienced enormous growth in recent years. However, for solar-cell technology to become competitive in the long term, both an increase in energy-generating efficiency and a reduction in production costs is required.
Several laser applications for solar-cell production are shown in Figure 1, of which three—hole drilling for back-contacted solar cells, silicon dioxide (SiO2) removal for making grooves, and scribing of thin-film cells—are described here in more detail.
Laser drilling is a key technology used in many new back-contact solar-cell production concepts because alternative economically feasible drilling processes are not yet available.To overcome this performance degradation, many new cell concepts are being developed, usually with the emitter contact either completely or partially on the rear.
This results in higher cell efficiencies for energy generation. For these emitter wrap-through (EWT) cells, laser drilling is the only suitable method to create the necessary holes from the front to the back. Typically, a drilling efficacy of 15,000 80μm-diameter holes is required.1 Figure 2 shows a typical hole. Up to several thousand holes can be drilled per second.
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